{"id":489,"date":"2019-12-24T12:53:28","date_gmt":"2019-12-24T04:53:28","guid":{"rendered":"http:\/\/www.eniac.one\/?page_id=489"},"modified":"2024-02-28T00:48:17","modified_gmt":"2024-02-27T16:48:17","slug":"oven-process-efficiency-improvement","status":"publish","type":"page","link":"https:\/\/eniac.one\/en\/semiconductor-packaging-testing-value-application-solution\/oven-process-efficiency-improvement\/","title":{"rendered":"Oven Process Efficiency Improvement."},"content":{"rendered":"<p class=\"has-accent-color has-text-color has-link-color has-medium-font-size wp-elements-7ba641244b50f28aeb2c46da233b105a\"><strong>Lightweight Semiconductor Packaging Post-Flattening Die Fixture<\/strong><\/p>\n\n\n\n<p><strong>Current Bottlenecks:<\/strong><br><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Existing in-house fixtures are prone to damage and deformation, and their use is cumbersome, leading to increased personnel burden.<\/li>\n\n\n\n<li>The existing in-house fixtures are of old-fashioned design, with excessive volume\/weight, limiting the quantity of oven equipment according to specifications and affecting product throughput.<\/li>\n\n\n\n<li>The old fixtures have a prolonged cooling time after exiting the oven, resulting in extended cycle times in the PMC process.<\/li>\n\n\n\n<li>Poor capability to improve product warpage.<\/li>\n<\/ol>\n\n\n\n<p><strong>Objectives:<\/strong><br><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Design dedicated oven fixtures based on characteristics (considering product throughput\/weight\/volume\/operator convenience, etc.).<\/li>\n\n\n\n<li>Increase throughput in terms of quantity and cooling efficiency to increase PMC process capacity UPH. Effectively reduce cycle time and improve fixture turnover rate.<\/li>\n\n\n\n<li>Higher durability compared to old fixtures.<\/li>\n\n\n\n<li>Effectively address product warpage issues.<\/li>\n<\/ol>\n\n\n\n<p><strong>Application Benefits:<\/strong><br>81% lighter than traditional fixtures, significantly increasing baking volume and reducing cooling time and overall cycle time.<br><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li>Oven loading capacity increased by 25% UPH.<\/li>\n\n\n\n<li>Oven process efficiency can be increased by 39% UPH. *This data is based on actual measurements in the packaging plant.<\/li>\n<\/ol>\n\n\n\n<p><strong>Appearance Description:<\/strong><\/p>\n\n\n\n<p>Oven fixture compression fixture<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"328\" height=\"444\" src=\"https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/pt4.jpg\" alt=\"\" class=\"wp-image-1451\" srcset=\"https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/pt4.jpg 328w, https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/pt4-222x300.jpg 222w\" sizes=\"auto, (max-width: 328px) 100vw, 328px\" \/><\/figure>\n\n\n\n<p>Oven baking fixture<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"613\" src=\"https:\/\/www.eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7-1024x613.png\" alt=\"\" class=\"wp-image-1453\" srcset=\"https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7-1024x613.png 1024w, https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7-300x180.png 300w, https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7-768x460.png 768w, https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7-1536x919.png 1536w, https:\/\/eniac.one\/wp-content\/uploads\/2021\/03\/\u6355\u83b7.png 1830w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Lightweight Semiconductor Packaging Post-Flattening Die &#8230; <a title=\"Oven Process Efficiency Improvement.\" class=\"read-more\" href=\"https:\/\/eniac.one\/en\/semiconductor-packaging-testing-value-application-solution\/oven-process-efficiency-improvement\/\" aria-label=\"Read more about Oven Process Efficiency Improvement.\">Read more<\/a><\/p>","protected":false},"author":1,"featured_media":0,"parent":1465,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_coblocks_attr":"","_coblocks_dimensions":"","_coblocks_responsive_height":"","_coblocks_accordion_ie_support":"","footnotes":""},"class_list":["post-489","page","type-page","status-publish"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Oven Process Efficiency Improvement. - eniacONE<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/eniac.one\/en\/semiconductor-packaging-testing-value-application-solution\/oven-process-efficiency-improvement\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Oven Process Efficiency Improvement. - eniacONE\" \/>\n<meta property=\"og:description\" content=\"Lightweight Semiconductor Packaging Post-Flattening Die ... 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