Lightweight Semiconductor Packaging Post-Flattening Die Fixture
Current Bottlenecks:
- Existing in-house fixtures are prone to damage and deformation, and their use is cumbersome, leading to increased personnel burden.
- The existing in-house fixtures are of old-fashioned design, with excessive volume/weight, limiting the quantity of oven equipment according to specifications and affecting product throughput.
- The old fixtures have a prolonged cooling time after exiting the oven, resulting in extended cycle times in the PMC process.
- Poor capability to improve product warpage.
Objectives:
- Design dedicated oven fixtures based on characteristics (considering product throughput/weight/volume/operator convenience, etc.).
- Increase throughput in terms of quantity and cooling efficiency to increase PMC process capacity UPH. Effectively reduce cycle time and improve fixture turnover rate.
- Higher durability compared to old fixtures.
- Effectively address product warpage issues.
Application Benefits:
81% lighter than traditional fixtures, significantly increasing baking volume and reducing cooling time and overall cycle time.
- Oven loading capacity increased by 25% UPH.
- Oven process efficiency can be increased by 39% UPH. *This data is based on actual measurements in the packaging plant.
Appearance Description:
Oven fixture compression fixture
Oven baking fixture
